TC Componentes es distribuidor de Samtec en España y Portugal
Elige entre millones de conectores sin retrasar tu diseño. Samtec está en el top 3 de los fabricantes de conectores de PCB a nivel mundial. Y es el fabricante con el mejor servicio al cliente (mejor servicio al cliente durante 18 años consecutivos, Bishop Associates).
Con Samtec y TC tienes muestras en 48h, entregas rápidas sin pedidos mínimos, y productos sin obsolescencias. Y la posibilidad de personalización extrema: hay más de 2.000 millones de productos posibles. No tienes por qué quedarte con una especificación de serie hecha para otro caso. Ahorra tiempo con nuestro asesoramiento y selecciona de manera eficaz los componentes adecuados para tu producto. Porque si falla el conector, falla todo.
1
Personalización extrema
con millones de combinaciones posibles
2
Asesoramiento técnico para elegir el conector perfecto
3
Entrega rápida
sin pedidos mínimos
300.000 coches eléctricos funcionan gracias a nuestros conectores
Catálogo de componentes Samtec - HDAM - 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
High-Speed Board-to-Board > High-Density Arrays > HD Mezz Array > HDAM - 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
High-Speed Board-to-Board
Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.
High-Speed Performance: Speeds to 112 Gbps PAM4; More than 4.0 Tbps of aggregate bandwidth; Extremely low crosstalk beyond 40 GHz
ApplicationFlexibility: 10-1,000 positions; 1 mm - 40 mm stack heights; Vertical, right-angle, edge mount
Signal Integrity Support: Free test reports, models, app notes, Break Out Region; Easy access to live EE support; Channelyzer® online tool
High-Density Arrays
Samtec high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.
HD Mezz Array
Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.
HDAM - 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
Solder charge termination for ease of processing
Up to 299 I/Os
HD Mezz is a trademark of Molex Incorporated
Intermateable with Molex HD Mezz Arrays
Integrated guide posts to minimize contact damage when mating and unmating
Performance: Up to 9 GHz / 18 Gbps
Current rating: 1.8 A max
Voltage rating: 230 VAC/325 VDC max
2.00 mm x 1.20 mm pitch
Open pin field design
Codigo
Nombre
Características
Fabricante
PDFs
HDAM-11-12.0-S-13-1
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Not Applicable, 11, -13, Not Selected, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
11
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-11-12.0-S-13-1-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Show, 11, -13, P, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Show
Number of Positions
11
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-11-12.0-S-13-1-P-TR
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Show, 11, -13, P, TR, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Show
Number of Positions
11
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
TR
Solder Charge Material
1
Samtec
HDAM-11-12.0-S-13-2
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Not Applicable, 11, -13, Not Selected, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
11
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
2
Samtec
HDAM-11-12.0-S-13-2-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Show, 11, -13, P, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Show
Number of Positions
11
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
Not Selected
Solder Charge Material
2
Samtec
HDAM-11-12.0-S-13-2-P-TR
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Show, 11, -13, P, TR, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Show
Number of Positions
11
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
TR
Solder Charge Material
2
Samtec
HDAM-11-17.0-S-13-1
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Not Applicable, 11, -13, Not Selected, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
11
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-11-17.0-S-13-1-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Show, 11, -13, P, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Show
Number of Positions
11
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-11-17.0-S-13-1-P-TR
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Show, 11, -13, P, TR, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Show
Number of Positions
11
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
TR
Solder Charge Material
1
Samtec
HDAM-11-17.0-S-13-2
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Not Applicable, 11, -13, Not Selected, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
11
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
2
Samtec
HDAM-11-17.0-S-13-2-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Show, 11, -13, P, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Show
Number of Positions
11
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
Not Selected
Solder Charge Material
2
Samtec
HDAM-15-12.0-S-13-1
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Not Applicable, 15, -13, Not Selected, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
15
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-15-12.0-S-13-1-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Show, 15, -13, P, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Show
Number of Positions
15
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-15-12.0-S-13-2
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Not Applicable, 15, -13, Not Selected, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
15
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
2
Samtec
HDAM-15-12.0-S-13-2-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Show, 15, -13, P, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Show
Number of Positions
15
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
Not Selected
Solder Charge Material
2
Samtec
HDAM-15-17.0-S-13-1
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Not Applicable, 15, -13, Not Selected, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
15
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-15-17.0-S-13-1-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Show, 15, -13, P, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Show
Number of Positions
15
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-15-17.0-S-13-2
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Not Applicable, 15, -13, Not Selected, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
15
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
2
Samtec
HDAM-15-17.0-S-13-2-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Show, 15, -13, P, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Show
Number of Positions
15
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
Not Selected
Solder Charge Material
2
Samtec
HDAM-23-12.0-S-13-1
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Not Applicable, 23, -13, Not Selected, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
23
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-23-12.0-S-13-1-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Show, 23, -13, P, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Show
Number of Positions
23
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-23-12.0-S-13-1-TR
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Not Applicable, 23, -13, Not Selected, TR, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
23
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
TR
Solder Charge Material
1
Samtec
HDAM-23-12.0-S-13-2
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Not Applicable, 23, -13, Not Selected, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
23
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
2
Samtec
HDAM-23-12.0-S-13-2-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Show, 23, -13, P, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Show
Number of Positions
23
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
Not Selected
Solder Charge Material
2
Samtec
HDAM-23-12.0-S-13-2-TR
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 12.0, Not Applicable, 23, -13, Not Selected, TR, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
12.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
23
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
TR
Solder Charge Material
2
Samtec
HDAM-23-17.0-S-13-1
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Not Applicable, 23, -13, Not Selected, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
23
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-23-17.0-S-13-1-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Show, 23, -13, P, Not Selected, 1
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Show
Number of Positions
23
Number of Rows
-13
Pick & Place Pad
P
Tape & Reel
Not Selected
Solder Charge Material
1
Samtec
HDAM-23-17.0-S-13-2
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Not Applicable, 23, -13, Not Selected, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
Lead Style
17.0
Pad Show/Hide (Model Only)
Not Applicable
Number of Positions
23
Number of Rows
-13
Pick & Place Pad
Not Selected
Tape & Reel
Not Selected
Solder Charge Material
2
Samtec
HDAM-23-17.0-S-13-2-P
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins, 17.0, Show, 23, -13, P, Not Selected, 2
Plating
-S: 30µ" Selective Gold in Mating Area, Matte Tin on Tail and Guide Pins
TC Componentes es proveedor industrial de este producto. Podemos facilitarte muestras, ayudarte en tu diseño y proporcionar un suministro estable al mejor precio.
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Respondemos a todo lo que quieres saber (y nadie más responde)
1
¿Qué diferencia a TC Componentes como distribuidor de Samtec?
TC Componentes pone a tu disposición un profundo conocimiento técnico y gran experiencia en soluciones de interconexión.
Nuestra relación cercana con Samtec nos permite ofrecer soporte técnico avanzado y soluciones de diseño personalizadas, garantizando que cada proyecto se ejecute con la máxima precisión y eficiencia.
Esto te ahorra la abrumadora tarea de buscar el conector que necesitas y evita futuros errores que desestabilicen el proyecto.
Además, nuestra capacidad de respuesta es de las más rápidas del mercado. Nos comprometemos a que todas consultas y necesidades sean atendidas sin demoras ni tiempos muertos.
Por último, también gestionamos la entrega de productos listos para usar, reduciendo el tiempo de instalación y el riesgo de errores.
2
¿Qué tipo de proyectos atendéis en TC Componentes como distribuidores de Samtec?
Si eres un fabricante de equipos electrónicos en series cortas, medias o largas, y operas en sectores como electrónica industrial, automoción, electromedicina, telecomunicaciones, sistemas de seguridad, robótica o defensa, TC Componentes es tu socio ideal.
Nos enfocamos en dos tipos de clientes:
– Fabricantes que valoran un servicio eficiente y productos de alta calidad en sectores como máquinas de vending, sistemas de pago, videoporteros, elevadores, robótica, defensa, o electromedicina.
– Proyectos que se benefician de nuestra especialización, en los que nuestro conocimiento técnico garantiza soluciones precisas y eficientes.
3
¿Cuáles son las aplicaciones más frecuentes de los productos de Samtec?
Los productos de Samtec se utilizan frecuentemente en aplicaciones de automoción, aeroespacial, industrial, telecomunicaciones y centros de datos.
Además, debido a su conexión fiable y de alta velocidad en diversas aplicaciones críticas, también se utilizan en equipos médicos, de agricultura o transporte ferroviario y naval.
4
¿Por qué es importante elegir bien un conector para el diseño global?
Elegir el conector adecuado es crucial para el diseño global porque afecta directamente la fiabilidad y el rendimiento del sistema.
Un conector mal seleccionado puede causar fallos de conexión, interferencias y problemas de compatibilidad difíciles de detectar y solucionar, afectando a la integridad del diseño.
En TC Componentes, ayudamos a minimizar estos riesgos proporcionando asesoramiento técnico y soluciones de interconexión optimizadas, asegurando que cada componente se integre de manera eficiente en el sistema.
5
¿Hacéis muestras gratuitas de los productos de Samtec?
Sí, ofrecemos muestras gratuitas para que los clientes prueben y evalúen los conectores en sus propios entornos antes de realizar una compra a gran escala.
Las muestras ayudan a garantizar que el producto elegido cumple con los requisitos técnicos y operativos específicos del proyecto.
6
¿Cuáles son los plazos de entrega de los productos de Samtec?
Samtec se distingue por su rapidez en la entrega. Además, para casos urgentes ofrece un servicio llamado «sudden service» que garantiza envíos desde fábrica de más de 200.000 piezas en tan solo 24 horas desde la confirmación del pedido.
En TC Componentes, aprovechamos esta agilidad para asegurar que recibas tus productos de manera eficiente, adaptándonos a tus necesidades específicas y reduciendo al mínimo los tiempos de espera.
7
¿Cuáles son los siguientes pasos para obtener más información o realizar un pedido?
Para obtener más información o realizar un pedido, contacta con nuestro equipo de ventas y soporte técnico.
Estamos disponibles para responder a tus preguntas, proporcionar asesoramiento personalizado y ayudarte a seleccionar los productos más adecuados para tu proyecto.
Puedes contactarnos a través de nuestra web y te responderemos en un plazo máximo de 48 horas.
