Samtec – conectores de alta velocidad

HDTF - XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle de Samtec

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TC Componentes soluciones de electrónica industrial
TC Componentes soluciones de electrónica industrial

TC Componentes es distribuidor de Samtec en España y Portugal

Elige entre millones de conectores sin retrasar tu diseño. Samtec está en el top 3 de los fabricantes de conectores de PCB a nivel mundial. Y es el fabricante con el mejor servicio al cliente (mejor servicio al cliente durante 18 años consecutivos, Bishop Associates).

Con Samtec y TC tienes muestras en 48h, entregas rápidas sin pedidos mínimos, y productos sin obsolescencias. Y la posibilidad de personalización extrema: hay más de 2.000 millones de productos posibles. No tienes por qué quedarte con una especificación de serie hecha para otro caso. Ahorra tiempo con nuestro asesoramiento y selecciona de manera eficaz los componentes adecuados para tu producto. Porque si falla el conector, falla todo.

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Personalización extrema
con millones de combinaciones posibles

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Asesoramiento técnico
para elegir el conector perfecto

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Entrega rápida
sin pedidos mínimos

300.000 coches eléctricos funcionan gracias a nuestros conectores

Catálogo de componentes Samtec - HDTF - XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle

Fabricante

High-Speed Board-to-Board > Backplane Connectors > XCede® HD High-Density Backplane System > HDTF - XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle

High-Speed Board-to-Board

Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.

  • High-Speed Performance: Speeds to 112 Gbps PAM4; More than 4.0 Tbps of aggregate bandwidth; Extremely low crosstalk beyond 40 GHz
  • ApplicationFlexibility: 10-1,000 positions; 1 mm - 40 mm stack heights; Vertical, right-angle, edge mount
  • Signal Integrity Support: Free test reports, models, app notes, Break Out Region; Easy access to live EE support; Channelyzer® online tool

Backplane Connectors

High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility. NovaRay® micro rugged backplane system enables performance to 112 Gbps PAM4 with an offset footprint and provides configurable signal banks for design flexibility.

XCede® HD High-Density Backplane System
Samtec's XCede® HD high-density backplane system features a small form factor ideal for density-critical applications, and a modular design for flexibility and customizable solutions.
HDTF - XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle
HDTF - XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle
  • Modular design provides flexibility in applications
  • 85 Ω and 100 Ω options
  • Standard or high-speed wafers available
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • Current rating: 1.5 A max
  • Voltage rating: 48 VAC/68 VDC max
Codigo Nombre Características Fabricante PDFs
HDTF-3-04-S-RA-HS-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 7.2, 04, 3, HS, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A7.2
Columns04
Pairs per Column3
WafersHS
Impedance100
Samtec
HDTF-3-04-S-RA-LC-085 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 7.2, 04, 3, LC, 085
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A7.2
Columns04
Pairs per Column3
WafersLC
Impedance085
Samtec
HDTF-3-04-S-RA-LC-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 7.2, 04, 3, LC, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A7.2
Columns04
Pairs per Column3
WafersLC
Impedance100
Samtec
HDTF-3-06-S-RA-HS-085 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 10.8, 06, 3, HS, 085
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A10.8
Columns06
Pairs per Column3
WafersHS
Impedance085
Samtec
HDTF-3-06-S-RA-HS-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 10.8, 06, 3, HS, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A10.8
Columns06
Pairs per Column3
WafersHS
Impedance100
Samtec
HDTF-3-06-S-RA-LC-085 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 10.8, 06, 3, LC, 085
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A10.8
Columns06
Pairs per Column3
WafersLC
Impedance085
Samtec
HDTF-3-06-S-RA-LC-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 10.8, 06, 3, LC, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A10.8
Columns06
Pairs per Column3
WafersLC
Impedance100
Samtec
HDTF-3-08-S-RA-HS-085 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 14.4, 08, 3, HS, 085
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A14.4
Columns08
Pairs per Column3
WafersHS
Impedance085
Samtec
HDTF-3-08-S-RA-HS-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 14.4, 08, 3, HS, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A14.4
Columns08
Pairs per Column3
WafersHS
Impedance100
Samtec
HDTF-3-08-S-RA-LC-085 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 14.4, 08, 3, LC, 085
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A14.4
Columns08
Pairs per Column3
WafersLC
Impedance085
Samtec
HDTF-3-08-S-RA-LC-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 14.4, 08, 3, LC, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A14.4
Columns08
Pairs per Column3
WafersLC
Impedance100
Samtec
HDTF-4-04-S-RA-HS-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 7.2, 04, 4, HS, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A7.2
Columns04
Pairs per Column4
WafersHS
Impedance100
Samtec
HDTF-4-04-S-RA-LC-085 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 7.2, 04, 4, LC, 085
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A7.2
Columns04
Pairs per Column4
WafersLC
Impedance085
Samtec
HDTF-4-04-S-RA-LC-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 7.2, 04, 4, LC, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A7.2
Columns04
Pairs per Column4
WafersLC
Impedance100
Samtec
HDTF-4-06-S-RA-HS-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 10.8, 06, 4, HS, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A10.8
Columns06
Pairs per Column4
WafersHS
Impedance100
Samtec
HDTF-4-06-S-RA-LC-085 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 10.8, 06, 4, LC, 085
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A10.8
Columns06
Pairs per Column4
WafersLC
Impedance085
Samtec
HDTF-4-06-S-RA-LC-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 10.8, 06, 4, LC, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A10.8
Columns06
Pairs per Column4
WafersLC
Impedance100
Samtec
HDTF-4-08-S-RA-HS-085 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 14.4, 08, 4, HS, 085
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A14.4
Columns08
Pairs per Column4
WafersHS
Impedance085
Samtec
HDTF-4-08-S-RA-HS-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 14.4, 08, 4, HS, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A14.4
Columns08
Pairs per Column4
WafersHS
Impedance100
Samtec
HDTF-4-08-S-RA-LC-085 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 14.4, 08, 4, LC, 085
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A14.4
Columns08
Pairs per Column4
WafersLC
Impedance085
Samtec
HDTF-4-08-S-RA-LC-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 14.4, 08, 4, LC, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A14.4
Columns08
Pairs per Column4
WafersLC
Impedance100
Samtec
HDTF-6-04-S-RA-LC-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 7.2, 04, 6, LC, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A7.2
Columns04
Pairs per Column6
WafersLC
Impedance100
Samtec
HDTF-6-06-S-RA-HS-085 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 10.8, 06, 6, HS, 085
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A10.8
Columns06
Pairs per Column6
WafersHS
Impedance085
Samtec
HDTF-6-06-S-RA-LC-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 10.8, 06, 6, LC, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A10.8
Columns06
Pairs per Column6
WafersLC
Impedance100
Samtec
HDTF-6-08-S-RA-HS-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 14.4, 08, 6, HS, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A14.4
Columns08
Pairs per Column6
WafersHS
Impedance100
Samtec
HDTF-6-08-S-RA-LC-085 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 14.4, 08, 6, LC, 085
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A14.4
Columns08
Pairs per Column6
WafersLC
Impedance085
Samtec
HDTF-6-08-S-RA-LC-100 XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle -S : 30µ" Selective gold in contact area, Matte tin on tail, -RA: Right Angle, 14.4, 08, 6, LC, 100
Plating-S : 30µ" Selective gold in contact area, Matte tin on tail
Orientation-RA: Right Angle
A14.4
Columns08
Pairs per Column6
WafersLC
Impedance100
Samtec

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