Samtec – conectores de alta velocidad

hsec8 de Samtec

Catálogo de productos

TC Componentes soluciones de electrónica industrial
TC Componentes soluciones de electrónica industrial

TC Componentes es distribuidor de Samtec en España y Portugal

Elige entre millones de conectores sin retrasar tu diseño. Samtec está en el top 3 de los fabricantes de conectores de PCB a nivel mundial. Y es el fabricante con el mejor servicio al cliente (mejor servicio al cliente durante 18 años consecutivos, Bishop Associates).

Con Samtec y TC tienes muestras en 48h, entregas rápidas sin pedidos mínimos, y productos sin obsolescencias. Y la posibilidad de personalización extrema: hay más de 2.000 millones de productos posibles. No tienes por qué quedarte con una especificación de serie hecha para otro caso. Ahorra tiempo con nuestro asesoramiento y selecciona de manera eficaz los componentes adecuados para tu producto. Porque si falla el conector, falla todo.

1

Personalización extrema
con millones de combinaciones posibles

2

Asesoramiento técnico
para elegir el conector perfecto

3

Entrega rápida
sin pedidos mínimos

300.000 coches eléctricos funcionan gracias a nuestros conectores

Catálogo de componentes Samtec - hsec8 (Página 1 de 5)

Fabricante

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hsec8
Codigo Nombre Características Fabricante PDFs
HSEC8-108-01-L-DP-A-K -DP: Differential Pair, -A: Alignment Pin, L, 17.40, -K: Polyimide film pad, blank: Tape & Reel, blank: No Weld Tab, -01: (1.57 mm) .062" thick card, 08, 15.00
Style-DP: Differential Pair
Alignment Pin-A: Alignment Pin
Plating SpecificationL
A17.40
Pick and Place Option-K: Polyimide film pad
Packaging Optionblank: Tape & Reel
Weld Tabblank: No Weld Tab
Card Thickness-01: (1.57 mm) .062" thick card
Number of Pairs (Total)08
J15.00
Samtec
HSEC8-108-01-L-DP-A-WT-K -DP: Differential Pair, -A: Alignment Pin, L, 17.40, -K: Polyimide film pad, blank: Tape & Reel, WT, -01: (1.57 mm) .062" thick card, 08, 15.00
Style-DP: Differential Pair
Alignment Pin-A: Alignment Pin
Plating SpecificationL
A17.40
Pick and Place Option-K: Polyimide film pad
Packaging Optionblank: Tape & Reel
Weld TabWT
Card Thickness-01: (1.57 mm) .062" thick card
Number of Pairs (Total)08
J15.00
Samtec
HSEC8-109-01-L-DV-A-BL Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.177, 0.458, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)09
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-BL-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.177, 0.458, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)09
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-BL-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.177, 0.458, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)09
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-BL-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.177, 0.458, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)09
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-L2 Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.177, 0.458, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-L2-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.177, 0.458, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-L2-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.177, 0.458, -K, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-L2-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.177, 0.458, Not Selected, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-WT Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.177, 0.458, Not Selected, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-WT-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.177, 0.458, -K, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-WT-K-FR -FR, -DV: Dual Vertical, Show, -A, -L, 0.177, 0.458, -K, Not Available, -WT
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-WT-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.177, 0.458, -K, Not Available, -WT
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-L-DV-A-WT-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.177, 0.458, Not Selected, Not Available, -WT
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-L-RA Blank: Tray Packaging, L, 09, -RA - Right Angle, Not Selected, -1.57mm [0.62] Thick Card
Packaging OptionsBlank: Tray Packaging
Plating OptionL
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsNot Selected
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-L-RA-BL Blank: Tray Packaging, L, 09, -RA - Right Angle, BL, -1.57mm [0.62] Thick Card
Packaging OptionsBlank: Tray Packaging
Plating OptionL
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsBL
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-L-RA-BL-FR -FR, L, 09, -RA - Right Angle, BL, -1.57mm [0.62] Thick Card
Packaging Options-FR
Plating OptionL
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsBL
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-L-RA-BL-TR -TR, L, 09, -RA - Right Angle, BL, -1.57mm [0.62] Thick Card
Packaging Options-TR
Plating OptionL
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsBL
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-L-RA-L2 Blank: Tray Packaging, L, 09, -RA - Right Angle, L2, -1.57mm [0.62] Thick Card
Packaging OptionsBlank: Tray Packaging
Plating OptionL
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsL2
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-L-RA-L2-FR -FR, L, 09, -RA - Right Angle, L2, -1.57mm [0.62] Thick Card
Packaging Options-FR
Plating OptionL
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsL2
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-L-RA-L2-TR -TR, L, 09, -RA - Right Angle, L2, -1.57mm [0.62] Thick Card
Packaging Options-TR
Plating OptionL
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsL2
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-L-RA-TR -TR, L, 09, -RA - Right Angle, Not Selected, -1.57mm [0.62] Thick Card
Packaging Options-TR
Plating OptionL
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsNot Selected
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-S-DV-A-BL Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 0.177, 0.458, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)09
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-S-DV-A-BL-K-TR -TR, -DV: Dual Vertical, Show, -A, -S, 0.177, 0.458, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.177
B0.458
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)09
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-S-DV-A-BL-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -S, 0.177, 0.458, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)09
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-S-DV-A-L2 Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 0.177, 0.458, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-109-01-S-DV-A-L2-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 0.177, 0.458, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.177
B0.458
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-109-01-S-DV-A-L2-K-TR -TR, -DV: Dual Vertical, Show, -A, -S, 0.177, 0.458, -K, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.177
B0.458
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-109-01-S-DV-A-L2-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -S, 0.177, 0.458, Not Selected, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-109-01-S-DV-A-WT Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 0.177, 0.458, Not Selected, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-S-DV-A-WT-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 0.177, 0.458, -K, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.177
B0.458
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)09
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-109-01-S-RA-BL Blank: Tray Packaging, S, 09, -RA - Right Angle, BL, -1.57mm [0.62] Thick Card
Packaging OptionsBlank: Tray Packaging
Plating OptionS
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsBL
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-S-RA-BL-TR -TR, S, 09, -RA - Right Angle, BL, -1.57mm [0.62] Thick Card
Packaging Options-TR
Plating OptionS
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsBL
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-S-RA-L2 Blank: Tray Packaging, S, 09, -RA - Right Angle, L2, -1.57mm [0.62] Thick Card
Packaging OptionsBlank: Tray Packaging
Plating OptionS
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsL2
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-S-RA-L2-TR -TR, S, 09, -RA - Right Angle, L2, -1.57mm [0.62] Thick Card
Packaging Options-TR
Plating OptionS
Number of Positions (per Row)09
Row Specification-RA - Right Angle
OptionsL2
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-109-01-SM-DV-A-BL Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -SM, 0.177, 0.458, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-SM
A0.177
B0.458
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)09
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-H-DV Tray Packaging, -DV: Dual Vertical, Not Applicable, Not Selected, -H, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment PinNot Selected
Plating Specification-H
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-H-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -H, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-H
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-H-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -H, 0.000, 0.000, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-H
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-H-DV-A-K-TR -TR, -DV: Dual Vertical, Show, -A, -H, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-H
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-H-DV-A-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -H, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-H
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-H-DV-A-WT-K-TR -TR, -DV: Dual Vertical, Show, -A, -H, 0.000, 0.000, -K, Not Available, -WT
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-H
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-D-EM2 L, 10, D - Double, EM2, 01 - 1.57mm[0.62] Thick Card
Plating OptionL
Number of Positions (per Row)10
Number of RowsD - Double
Tail OptionEM2
Card Thickness01 - 1.57mm[0.62] Thick Card
Samtec
HSEC8-110-01-L-DV Tray Packaging, -DV: Dual Vertical, Not Applicable, Not Selected, -L, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment PinNot Selected
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-L-DV-A-BL Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-BL-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-BL-K-FR -FR, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-BL-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-BL-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-FR -FR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-L-DV-A-GR-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide Rails-GR
Samtec
HSEC8-110-01-L-DV-A-GR-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide Rails-GR
Samtec
HSEC8-110-01-L-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-L-DV-A-K-FR -FR, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-L-DV-A-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-L-DV-A-PE Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-PE-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-PE-K-FR -FR, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-PE-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-PE-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-L-DV-A-WT Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-WT-FR -FR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, -WT
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-WT-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-WT-K-FR -FR, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, -WT
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-WT-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, -WT
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-A-WT-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, -WT
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-GR-TR Samtec
HSEC8-110-01-L-DV-K-FR -FR, -DV: Dual Vertical, Show, Not Selected, -L, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-K-TR -TR, -DV: Dual Vertical, Show, Not Selected, -L, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-DV-TR -TR, -DV: Dual Vertical, Not Applicable, Not Selected, -L, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment PinNot Selected
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-L-RA Blank: Tray Packaging, L, 10, -RA - Right Angle, Not Available, -1.57mm [0.62] Thick Card
Packaging OptionsBlank: Tray Packaging
Plating OptionL
Number of Positions (per Row)10
Row Specification-RA - Right Angle
OptionsNot Available
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-110-01-L-RA-FR -FR, L, 10, -RA - Right Angle, Not Available, -1.57mm [0.62] Thick Card
Packaging Options-FR
Plating OptionL
Number of Positions (per Row)10
Row Specification-RA - Right Angle
OptionsNot Available
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-110-01-L-RA-TR -TR, L, 10, -RA - Right Angle, Not Available, -1.57mm [0.62] Thick Card
Packaging Options-TR
Plating OptionL
Number of Positions (per Row)10
Row Specification-RA - Right Angle
OptionsNot Available
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-110-01-S-D-EM2 S, 10, D - Double, EM2, 01 - 1.57mm[0.62] Thick Card
Plating OptionS
Number of Positions (per Row)10
Number of RowsD - Double
Tail OptionEM2
Card Thickness01 - 1.57mm[0.62] Thick Card
Samtec
HSEC8-110-01-S-DV Tray Packaging, -DV: Dual Vertical, Not Applicable, Not Selected, -S, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment PinNot Selected
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-S-DV-A-BL Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-BL-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-BL-K-TR -TR, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-BL-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-FR -FR, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-S-DV-A-GR-K-FR -FR, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide Rails-GR
Samtec
HSEC8-110-01-S-DV-A-GR-K-TR -TR, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide Rails-GR
Samtec
HSEC8-110-01-S-DV-A-GR-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide Rails-GR
Samtec
HSEC8-110-01-S-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-S-DV-A-K-FR -FR, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-S-DV-A-K-TR -TR, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-S-DV-A-PE Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-PE-FR -FR, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-PE-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-PE-K-FR -FR, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-PE-K-TR -TR, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-PE-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-S-DV-A-WT Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-WT-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-WT-K-TR -TR, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, -WT
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-A-WT-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, -WT
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-K Tray Packaging, -DV: Dual Vertical, Show, Not Selected, -S, 0.000, 0.000, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-K-FR -FR, -DV: Dual Vertical, Show, Not Selected, -S, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-K-TR -TR, -DV: Dual Vertical, Show, Not Selected, -S, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-DV-TR -TR, -DV: Dual Vertical, Not Applicable, Not Selected, -S, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment PinNot Selected
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-S-RA Blank: Tray Packaging, S, 10, -RA - Right Angle, Not Available, -1.57mm [0.62] Thick Card
Packaging OptionsBlank: Tray Packaging
Plating OptionS
Number of Positions (per Row)10
Row Specification-RA - Right Angle
OptionsNot Available
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-110-01-S-RA-FR -FR, S, 10, -RA - Right Angle, Not Available, -1.57mm [0.62] Thick Card
Packaging Options-FR
Plating OptionS
Number of Positions (per Row)10
Row Specification-RA - Right Angle
OptionsNot Available
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-110-01-S-RA-TR -TR, S, 10, -RA - Right Angle, Not Available, -1.57mm [0.62] Thick Card
Packaging Options-TR
Plating OptionS
Number of Positions (per Row)10
Row Specification-RA - Right Angle
OptionsNot Available
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-110-01-SM-DV Tray Packaging, -DV: Dual Vertical, Not Applicable, Not Selected, -SM, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment PinNot Selected
Plating Specification-SM
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-SM-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -SM, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-SM
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-SM-DV-A-BL Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -SM, 0.000, 0.000, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-SM
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-SM-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -SM, 0.000, 0.000, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-SM
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-SM-DV-A-K-FR -FR, -DV: Dual Vertical, Show, -A, -SM, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-SM
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-SM-DV-A-K-TR -TR, -DV: Dual Vertical, Show, -A, -SM, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-SM
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-SM-DV-A-PE-K-TR -TR, -DV: Dual Vertical, Show, -A, -SM, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-SM
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-01-SM-DV-A-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -SM, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-SM
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Selected
Samtec
HSEC8-110-01-SM-DV-K-TR -TR, -DV: Dual Vertical, Show, Not Selected, -SM, 0.000, 0.000, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-SM
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-L-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-L-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-L-DV-A-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-L-DV-A-WT Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.000, 0.000, Not Selected, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-L-DV-A-WT-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-L-DV-A-WT-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.000, 0.000, -K, Not Available, -WT
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-S-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-S-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-S-DV-A-K-FR -FR, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-S-DV-A-K-TR -TR, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-S-DV-A-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-S-DV-A-WT Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-S-DV-A-WT-K-TR -TR, -DV: Dual Vertical, Show, -A, -S, 0.000, 0.000, -K, Not Available, -WT
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-110-03-S-DV-A-WT-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -S, 0.000, 0.000, Not Selected, Not Available, -WT
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A0.000
B0.000
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-03
No. of Positions (per Row)10
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-H-DV-K Tray Packaging, -DV: Dual Vertical, Show, Not Selected, -H, 1.059, 3.331, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-H
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-L-DV Tray Packaging, -DV: Dual Vertical, Not Applicable, Not Selected, -L, 1.059, 3.331, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment PinNot Selected
Plating Specification-L
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-L-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 1.059, 3.331, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-L-DV-A-BL Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 1.059, 3.331, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)100
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-L-DV-A-BL-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 1.059, 3.331, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)100
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-L-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 1.059, 3.331, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-L-DV-A-WT Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 1.059, 3.331, Not Selected, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-L-DV-A-WT-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 1.059, 3.331, -K, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-L-DV-K Tray Packaging, -DV: Dual Vertical, Show, Not Selected, -L, 1.059, 3.331, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-L
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-S-DV Tray Packaging, -DV: Dual Vertical, Not Applicable, Not Selected, -S, 1.059, 3.331, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment PinNot Selected
Plating Specification-S
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-S-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 1.059, 3.331, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-S-DV-A-BL Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 1.059, 3.331, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)100
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-S-DV-A-BL-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 1.059, 3.331, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)100
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-S-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 1.059, 3.331, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-S-DV-A-WT Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 1.059, 3.331, Not Selected, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-S-DV-A-WT-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 1.059, 3.331, -K, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-S-DV-K Tray Packaging, -DV: Dual Vertical, Show, Not Selected, -S, 1.059, 3.331, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-S
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-SM-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -SM, 1.059, 3.331, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-SM
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-SM-DV-A-BL Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -SM, 1.059, 3.331, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-SM
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)100
Board Locks-BL
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-SM-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -SM, 1.059, 3.331, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-SM
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Selected
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-01-SM-DV-K Tray Packaging, -DV: Dual Vertical, Show, Not Selected, -SM, 1.059, 3.331, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-SM
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-03-L-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 1.059, 3.331, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-03-L-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 1.059, 3.331, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-03-L-DV-A-WT Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 1.059, 3.331, Not Selected, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-03
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-03-L-DV-A-WT-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 1.059, 3.331, -K, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-03
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-03-S-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 1.059, 3.331, Not Selected, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-03-S-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 1.059, 3.331, -K, Not Available, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Selected
Card Thickness-03
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-03-S-DV-A-WT Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -S, 1.059, 3.331, Not Selected, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-S
A1.059
B3.331
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-03
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-1100-03-S-DV-A-WT-K Tray Packaging, -DV: Dual Vertical, Show, -A, -S, 1.059, 3.331, -K, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-S
A1.059
B3.331
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-03
No. of Positions (per Row)100
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-112-01-L-DP-A-K -DP: Differential Pair, -A: Alignment Pin, L, 22.20, -K: Polyimide film pad, blank: Tape & Reel, blank: No Weld Tab, -01: (1.57 mm) .062" thick card, 12, 19.80
Style-DP: Differential Pair
Alignment Pin-A: Alignment Pin
Plating SpecificationL
A22.20
Pick and Place Option-K: Polyimide film pad
Packaging Optionblank: Tape & Reel
Weld Tabblank: No Weld Tab
Card Thickness-01: (1.57 mm) .062" thick card
Number of Pairs (Total)12
J19.80
Samtec
HSEC8-112-01-L-DP-A-WT-K -DP: Differential Pair, -A: Alignment Pin, L, 22.20, -K: Polyimide film pad, blank: Tape & Reel, WT, -01: (1.57 mm) .062" thick card, 12, 19.80
Style-DP: Differential Pair
Alignment Pin-A: Alignment Pin
Plating SpecificationL
A22.20
Pick and Place Option-K: Polyimide film pad
Packaging Optionblank: Tape & Reel
Weld TabWT
Card Thickness-01: (1.57 mm) .062" thick card
Number of Pairs (Total)12
J19.80
Samtec
HSEC8-113-01-H-DV-A-BL-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -H, 0.240, 0.591, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-H
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-H-DV-A-L-K Tray Packaging, -DV: Dual Vertical, Show, -A, -H, 0.240, 0.591, -K, -L, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-H
A0.240
B0.591
Polyimide Film Pad-K
Latching-L
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-H-DV-A-PE-K-TR -TR, -DV: Dual Vertical, Show, -A, -H, 0.240, 0.591, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-H
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-H-DV-A-PE-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -H, 0.240, 0.591, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-H
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-D-EM2 L, 13, D - Double, EM2, 01 - 1.57mm[0.62] Thick Card
Plating OptionL
Number of Positions (per Row)13
Number of RowsD - Double
Tail OptionEM2
Card Thickness01 - 1.57mm[0.62] Thick Card
Samtec
HSEC8-113-01-L-DV Tray Packaging, -DV: Dual Vertical, Not Applicable, Not Selected, -L, 0.240, 0.591, Not Selected, Not Selected, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment PinNot Selected
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Selected
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.240, 0.591, Not Selected, Not Selected, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Selected
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Selected
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-BL Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.240, 0.591, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-BL-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-BL-K-FR -FR, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Available, Not Available
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-BL-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-BL-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.240, 0.591, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board Locks-BL
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Selected, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Selected
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Selected
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-K-FR -FR, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Selected, Not Selected
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Selected
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Selected
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Selected, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Selected
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Selected
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-L Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.240, 0.591, Not Selected, -L, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
Latching-L
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-L-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, -L, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
Latching-L
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-L2 Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.240, 0.591, Not Selected, Not Selected, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Selected
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-L2-FR -FR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.240, 0.591, Not Selected, Not Selected, Not Selected
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Selected
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-L2-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Selected, Not Selected
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Selected
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-L2-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Selected, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Selected
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-L2-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.240, 0.591, Not Selected, Not Selected, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Selected
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP Latching-L2
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-PE Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.240, 0.591, Not Selected, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-PE-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Available, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-PE-K-FR -FR, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Available, Not Available
Packaging Options-FR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-PE-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-PE-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.240, 0.591, Not Selected, Not Available, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Available
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Available
Pass Through-PE
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-TR -TR, -DV: Dual Vertical, Not Applicable, -A, -L, 0.240, 0.591, Not Selected, Not Selected, Not Selected
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Selected
Weld TabNot Selected
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Selected
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-WT Tray Packaging, -DV: Dual Vertical, Not Applicable, -A, -L, 0.240, 0.591, Not Selected, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-WT-K Tray Packaging, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Available, -WT
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-A-WT-K-TR -TR, -DV: Dual Vertical, Show, -A, -L, 0.240, 0.591, -K, Not Available, -WT
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment Pin-A
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Available
Weld Tab-WT
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Selected
Pass ThroughNot Selected
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-K Tray Packaging, -DV: Dual Vertical, Show, Not Selected, -L, 0.240, 0.591, -K, Not Selected, Not Available
Packaging OptionsTray Packaging
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Selected
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-K-TR -TR, -DV: Dual Vertical, Show, Not Selected, -L, 0.240, 0.591, -K, Not Selected, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Show
Alignment PinNot Selected
Plating Specification-L
A0.240
B0.591
Polyimide Film Pad-K
LatchingNot Selected
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-DV-TR -TR, -DV: Dual Vertical, Not Applicable, Not Selected, -L, 0.240, 0.591, Not Selected, Not Selected, Not Available
Packaging Options-TR
Row-DV: Dual Vertical
Pad Show/Hide (Model Only)Not Applicable
Alignment PinNot Selected
Plating Specification-L
A0.240
B0.591
Polyimide Film PadNot Selected
LatchingNot Selected
Weld TabNot Available
Card Thickness-01
No. of Positions (per Row)13
Board LocksNot Available
Pass ThroughNot Available
ECDP LatchingNot Available
Guide RailsNot Available
Samtec
HSEC8-113-01-L-RA Blank: Tray Packaging, L, 13, -RA - Right Angle, Not Selected, -1.57mm [0.62] Thick Card
Packaging OptionsBlank: Tray Packaging
Plating OptionL
Number of Positions (per Row)13
Row Specification-RA - Right Angle
OptionsNot Selected
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-113-01-L-RA-BL Blank: Tray Packaging, L, 13, -RA - Right Angle, BL, -1.57mm [0.62] Thick Card
Packaging OptionsBlank: Tray Packaging
Plating OptionL
Number of Positions (per Row)13
Row Specification-RA - Right Angle
OptionsBL
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-113-01-L-RA-BL-FR -FR, L, 13, -RA - Right Angle, BL, -1.57mm [0.62] Thick Card
Packaging Options-FR
Plating OptionL
Number of Positions (per Row)13
Row Specification-RA - Right Angle
OptionsBL
Card Thickness-1.57mm [0.62] Thick Card
Samtec
HSEC8-113-01-L-RA-BL-TR -TR, L, 13, -RA - Right Angle, BL, -1.57mm [0.62] Thick Card
Packaging Options-TR
Plating OptionL
Number of Positions (per Row)13
Row Specification-RA - Right Angle
OptionsBL
Card Thickness-1.57mm [0.62] Thick Card
Samtec

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