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SEAF8-RA - 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle de Samtec

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TC Componentes soluciones de electrónica industrial

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Catálogo de componentes Samtec
SEAF8-RA - 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

Fabricante: Samtec
Catálogo online de Samtec > High-Speed Board-to-Board > High-Density Arrays > SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays > SEAF8-RA - 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

High-Speed Board-to-Board

Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.

  • High-Speed Performance: Speeds to 112 Gbps PAM4; More than 4.0 Tbps of aggregate bandwidth; Extremely low crosstalk beyond 40 GHz
  • ApplicationFlexibility: 10-1,000 positions; 1 mm - 40 mm stack heights; Vertical, right-angle, edge mount
  • Signal Integrity Support: Free test reports, models, app notes, Break Out Region; Easy access to live EE support; Channelyzer® online tool

High-Density Arrays

Samtec high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.

SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays
These 0.80 mm pitch high-density arrays feature an open-pin-field for up to 50% board space savings.
SEAF8-RA - 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle
SEAF8-RA - 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle
  • High-density open-pin-field array
  • Right-angle design
  • 0.80 mm (.0315") pitch
  • Rugged Edge Rate® contact
  • 28 Gbps performance
  • Current rating: 1.1 A max
  • Voltage rating: 240 VAC/ 339 VDC max
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Guide post option available
Código Nombre Características Fabricante Docs
SEAF8-20-1-S-08-2-RA 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=20, Number of Rows=08 - Eight Rows 08 - Eight Rows, Guide Post=Not Selected, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions20
Number of Rows08 - Eight Rows 08 - Eight Rows
Guide PostNot Selected
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-20-1-S-08-2-RA-GP 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=20, Number of Rows=08 - Eight Rows 08 - Eight Rows, Guide Post=GP, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions20
Number of Rows08 - Eight Rows 08 - Eight Rows
Guide PostGP
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-20-1-S-10-2-RA 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=20, Number of Rows=10 - Ten Rows 10 - Ten Rows, Guide Post=Not Selected, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions20
Number of Rows10 - Ten Rows 10 - Ten Rows
Guide PostNot Selected
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-20-1-S-10-2-RA-GP 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=20, Number of Rows=10 - Ten Rows 10 - Ten Rows, Guide Post=GP, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions20
Number of Rows10 - Ten Rows 10 - Ten Rows
Guide PostGP
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-30-1-S-08-2-RA 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=30, Number of Rows=08 - Eight Rows 08 - Eight Rows, Guide Post=Not Selected, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions30
Number of Rows08 - Eight Rows 08 - Eight Rows
Guide PostNot Selected
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-30-1-S-08-2-RA-FR 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=FR, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=30, Number of Rows=08 - Eight Rows 08 - Eight Rows, Guide Post=Not Selected, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsFR
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions30
Number of Rows08 - Eight Rows 08 - Eight Rows
Guide PostNot Selected
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-30-1-S-08-2-RA-GP 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=30, Number of Rows=08 - Eight Rows 08 - Eight Rows, Guide Post=GP, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions30
Number of Rows08 - Eight Rows 08 - Eight Rows
Guide PostGP
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-30-1-S-10-2-RA 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=30, Number of Rows=10 - Ten Rows 10 - Ten Rows, Guide Post=Not Selected, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions30
Number of Rows10 - Ten Rows 10 - Ten Rows
Guide PostNot Selected
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-30-1-S-10-2-RA-GP 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=30, Number of Rows=10 - Ten Rows 10 - Ten Rows, Guide Post=GP, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions30
Number of Rows10 - Ten Rows 10 - Ten Rows
Guide PostGP
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-40-1-S-08-2-RA 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=40, Number of Rows=08 - Eight Rows 08 - Eight Rows, Guide Post=Not Selected, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions40
Number of Rows08 - Eight Rows 08 - Eight Rows
Guide PostNot Selected
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-40-1-S-08-2-RA-GP 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=40, Number of Rows=08 - Eight Rows 08 - Eight Rows, Guide Post=GP, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions40
Number of Rows08 - Eight Rows 08 - Eight Rows
Guide PostGP
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-40-1-S-10-2-RA 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=40, Number of Rows=10 - Ten Rows 10 - Ten Rows, Guide Post=Not Selected, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions40
Number of Rows10 - Ten Rows 10 - Ten Rows
Guide PostNot Selected
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-40-1-S-10-2-RA-GP 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=40, Number of Rows=10 - Ten Rows 10 - Ten Rows, Guide Post=GP, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions40
Number of Rows10 - Ten Rows 10 - Ten Rows
Guide PostGP
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-40-1-S-10-2-RA-GP-FR 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=FR, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=40, Number of Rows=10 - Ten Rows 10 - Ten Rows, Guide Post=GP, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsFR
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions40
Number of Rows10 - Ten Rows 10 - Ten Rows
Guide PostGP
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-50-1-S-04-2-RA 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=50, Number of Rows=04 - Four Rows 04 - Four Rows, Guide Post=Not Selected, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions50
Number of Rows04 - Four Rows 04 - Four Rows
Guide PostNot Selected
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-50-1-S-04-2-RA-GP 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=50, Number of Rows=04 - Four Rows 04 - Four Rows, Guide Post=GP, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions50
Number of Rows04 - Four Rows 04 - Four Rows
Guide PostGP
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-50-1-S-08-2-RA 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=50, Number of Rows=08 - Eight Rows 08 - Eight Rows, Guide Post=Not Selected, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions50
Number of Rows08 - Eight Rows 08 - Eight Rows
Guide PostNot Selected
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-50-1-S-08-2-RA-GP 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=50, Number of Rows=08 - Eight Rows 08 - Eight Rows, Guide Post=GP, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions50
Number of Rows08 - Eight Rows 08 - Eight Rows
Guide PostGP
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-50-1-S-10-2-RA 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=50, Number of Rows=10 - Ten Rows 10 - Ten Rows, Guide Post=Not Selected, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions50
Number of Rows10 - Ten Rows 10 - Ten Rows
Guide PostNot Selected
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec
SEAF8-50-1-S-10-2-RA-GP 0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket Packaging Options=Blank: Tape and Reel, Lead Style=-1, Plating Options=-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail, Number of Positions=50, Number of Rows=10 - Ten Rows 10 - Ten Rows, Guide Post=GP, Solder Type=-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Packaging OptionsBlank: Tape and Reel
Lead Style-1
Plating Options-S = 30 µ" (0.76 µ meters) Selective Gold on contact area, Matte Tin on solder tail
Number of Positions50
Number of Rows10 - Ten Rows 10 - Ten Rows
Guide PostGP
Solder Type-2: 95.5% Tin / 3.8% Silver / 0.7% Copper Lead Free Charge Tail
Samtec

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