Samtec – conectores de alta velocidad

NVAF - 0.80 mm NovaRay® Extreme Density & Performance Socket de Samtec

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TC Componentes soluciones de electrónica industrial
TC Componentes soluciones de electrónica industrial

TC Componentes es distribuidor de Samtec en España y Portugal

Elige entre millones de conectores sin retrasar tu diseño. Samtec está en el top 3 de los fabricantes de conectores de PCB a nivel mundial. Y es el fabricante con el mejor servicio al cliente (mejor servicio al cliente durante 18 años consecutivos, Bishop Associates).

Con Samtec y TC tienes muestras en 48h, entregas rápidas sin pedidos mínimos, y productos sin obsolescencias. Y la posibilidad de personalización extrema: hay más de 2.000 millones de productos posibles. No tienes por qué quedarte con una especificación de serie hecha para otro caso. Ahorra tiempo con nuestro asesoramiento y selecciona de manera eficaz los componentes adecuados para tu producto. Porque si falla el conector, falla todo.

1

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con millones de combinaciones posibles

2

Asesoramiento técnico
para elegir el conector perfecto

3

Entrega rápida
sin pedidos mínimos

300.000 coches eléctricos funcionan gracias a nuestros conectores

Catálogo de componentes Samtec - NVAF - 0.80 mm NovaRay® Extreme Density & Performance Socket

Fabricante

Samtec

High-Speed Board-to-Board > High-Density Arrays > NovaRay® 128 Gbps PAM4, Extreme Density Arrays > NVAF - 0.80 mm NovaRay® Extreme Density & Performance Socket

High-Speed Board-to-Board

Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.

  • High-Speed Performance: Speeds to 112 Gbps PAM4; More than 4.0 Tbps of aggregate bandwidth; Extremely low crosstalk beyond 40 GHz
  • ApplicationFlexibility: 10-1,000 positions; 1 mm - 40 mm stack heights; Vertical, right-angle, edge mount
  • Signal Integrity Support: Free test reports, models, app notes, Break Out Region; Easy access to live EE support; Channelyzer® online tool

High-Density Arrays

Samtec high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.

NovaRay® 128 Gbps PAM4, Extreme Density Arrays
NovaRay® combines extreme density and performance for 128 Gbps PAM4 per channel in 40% less space than traditional arrays.
NVAF - 0.80 mm NovaRay® Extreme Density & Performance Socket
NVAF - 0.80 mm NovaRay® Extreme Density & Performance Socket
  • 128 Gbps PAM4 per channel
  • PCIe® 7.0 capable
  • 7, 9, 10 and 12 mm stack heights
  • 2, 3 or 4 rows
  • 1 or 2 banks with up to 16 pairs/bank
  • Two points of contact ensure a more reliable connection
  • Minimal variance in data rate as stack height increases
  • Analog Over Array™ capable
  • Current rating: 2.1 A max (signal), 9.6 A max (ground)
  • Voltage rating: 200 VAC/283 VDC max
Codigo Nombre Características Fabricante PDFs
NVAF-DP-02-1-05.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 20.25, 4.775, 6.00, 05.0, -DP: 4 Pairs per Wafer, Show, 02, Not Selected, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A20.25
Dim B4.775
Dim C6.00
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows02
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-02-1-05.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 20.25, 4.775, 6.00, 05.0, -DP: 4 Pairs per Wafer, Show, 02, Not Selected, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A20.25
Dim B4.775
Dim C6.00
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows02
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-02-1-05.0-S-2-WT-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 23.65, 4.775, 6.00, 05.0, -DP: 4 Pairs per Wafer, Show, 02, WT, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A23.65
Dim B4.775
Dim C6.00
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows02
Weld Tab OptionWT
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-02-1-07.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 20.25, 6.775, 6.00, 07.0, -DP: 4 Pairs per Wafer, Show, 02, Not Available, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A20.25
Dim B6.775
Dim C6.00
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows02
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-02-1-07.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 20.25, 6.775, 6.00, 07.0, -DP: 4 Pairs per Wafer, Show, 02, Not Available, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A20.25
Dim B6.775
Dim C6.00
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows02
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-02-2-05.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 36.25, 4.775, 6.00, 05.0, -DP: 4 Pairs per Wafer, Show, 02, Not Selected, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A36.25
Dim B4.775
Dim C6.00
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows02
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-02-2-05.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 36.25, 4.775, 6.00, 05.0, -DP: 4 Pairs per Wafer, Show, 02, Not Selected, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A36.25
Dim B4.775
Dim C6.00
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows02
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-02-2-05.0-S-2-WT-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 39.65, 4.775, 6.00, 05.0, -DP: 4 Pairs per Wafer, Show, 02, WT, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A39.65
Dim B4.775
Dim C6.00
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows02
Weld Tab OptionWT
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-02-2-07.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 36.25, 6.775, 6.00, 07.0, -DP: 4 Pairs per Wafer, Show, 02, Not Available, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A36.25
Dim B6.775
Dim C6.00
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows02
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-02-2-07.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 36.25, 6.775, 6.00, 07.0, -DP: 4 Pairs per Wafer, Show, 02, Not Available, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A36.25
Dim B6.775
Dim C6.00
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows02
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-02-3-05.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 52.25, 4.775, 6.00, 05.0, -DP: 4 Pairs per Wafer, Show, 02, Not Available, -K: K-Pad - Provided as standard, 3, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A52.25
Dim B4.775
Dim C6.00
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows02
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks3
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-03-1-05.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 20.25, 4.775, 7.80, 05.0, -DP: 4 Pairs per Wafer, Show, 03, Not Selected, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A20.25
Dim B4.775
Dim C7.80
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows03
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-03-1-05.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 20.25, 4.775, 7.80, 05.0, -DP: 4 Pairs per Wafer, Show, 03, Not Selected, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A20.25
Dim B4.775
Dim C7.80
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows03
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-03-1-05.0-S-2-WT-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 23.65, 4.775, 7.80, 05.0, -DP: 4 Pairs per Wafer, Show, 03, WT, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A23.65
Dim B4.775
Dim C7.80
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows03
Weld Tab OptionWT
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-03-1-07.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 20.25, 6.775, 7.80, 07.0, -DP: 4 Pairs per Wafer, Show, 03, Not Available, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A20.25
Dim B6.775
Dim C7.80
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows03
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-03-1-07.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 20.25, 6.775, 7.80, 07.0, -DP: 4 Pairs per Wafer, Show, 03, Not Available, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A20.25
Dim B6.775
Dim C7.80
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows03
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-03-2-05.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 36.25, 4.775, 7.80, 05.0, -DP: 4 Pairs per Wafer, Show, 03, Not Selected, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A36.25
Dim B4.775
Dim C7.80
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows03
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-03-2-05.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 36.25, 4.775, 7.80, 05.0, -DP: 4 Pairs per Wafer, Show, 03, Not Selected, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A36.25
Dim B4.775
Dim C7.80
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows03
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-03-2-05.0-S-2-WT-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 39.65, 4.775, 7.80, 05.0, -DP: 4 Pairs per Wafer, Show, 03, WT, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A39.65
Dim B4.775
Dim C7.80
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows03
Weld Tab OptionWT
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-03-2-07.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 36.25, 6.775, 7.80, 07.0, -DP: 4 Pairs per Wafer, Show, 03, Not Available, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A36.25
Dim B6.775
Dim C7.80
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows03
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-03-2-07.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 36.25, 6.775, 7.80, 07.0, -DP: 4 Pairs per Wafer, Show, 03, Not Available, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A36.25
Dim B6.775
Dim C7.80
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows03
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-03-3-05.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 52.25, 4.775, 7.80, 05.0, -DP: 4 Pairs per Wafer, Show, 03, Not Available, -K: K-Pad - Provided as standard, 3, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A52.25
Dim B4.775
Dim C7.80
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows03
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks3
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-04-1-05.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 20.25, 4.775, 9.60, 05.0, -DP: 4 Pairs per Wafer, Show, 04, Not Selected, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A20.25
Dim B4.775
Dim C9.60
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows04
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-04-1-05.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 20.25, 4.775, 9.60, 05.0, -DP: 4 Pairs per Wafer, Show, 04, Not Selected, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A20.25
Dim B4.775
Dim C9.60
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows04
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-04-1-05.0-S-2-WT-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 23.65, 4.775, 9.60, 05.0, -DP: 4 Pairs per Wafer, Show, 04, WT, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A23.65
Dim B4.775
Dim C9.60
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows04
Weld Tab OptionWT
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-04-1-07.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 20.25, 6.775, 9.60, 07.0, -DP: 4 Pairs per Wafer, Show, 04, Not Available, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A20.25
Dim B6.775
Dim C9.60
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows04
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-04-1-07.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 20.25, 6.775, 9.60, 07.0, -DP: 4 Pairs per Wafer, Show, 04, Not Available, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A20.25
Dim B6.775
Dim C9.60
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows04
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-04-2-05.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 36.25, 4.775, 9.60, 05.0, -DP: 4 Pairs per Wafer, Show, 04, Not Selected, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A36.25
Dim B4.775
Dim C9.60
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows04
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-04-2-05.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 36.25, 4.775, 9.60, 05.0, -DP: 4 Pairs per Wafer, Show, 04, Not Selected, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A36.25
Dim B4.775
Dim C9.60
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows04
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-04-2-05.0-S-2-WT-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 39.65, 4.775, 9.60, 05.0, -DP: 4 Pairs per Wafer, Show, 04, WT, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A39.65
Dim B4.775
Dim C9.60
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows04
Weld Tab OptionWT
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-04-2-07.0-S-2-K-FR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -FR, 36.25, 6.775, 9.60, 07.0, -DP: 4 Pairs per Wafer, Show, 04, Not Available, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-FR
Dim A36.25
Dim B6.775
Dim C9.60
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows04
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-04-2-07.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 36.25, 6.775, 9.60, 07.0, -DP: 4 Pairs per Wafer, Show, 04, Not Available, -K: K-Pad - Provided as standard, 2, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A36.25
Dim B6.775
Dim C9.60
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows04
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks2
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-04-3-05.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 52.25, 4.775, 9.60, 05.0, -DP: 4 Pairs per Wafer, Show, 04, Not Available, -K: K-Pad - Provided as standard, 3, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A52.25
Dim B4.775
Dim C9.60
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows04
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks3
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-06-1-05.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 20.25, 4.775, 13.20, 05.0, -DP: 4 Pairs per Wafer, Show, 06, Not Selected, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A20.25
Dim B4.775
Dim C13.20
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows06
Weld Tab OptionNot Selected
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-06-1-05.0-S-2-WT-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 23.65, 4.775, 13.20, 05.0, -DP: 4 Pairs per Wafer, Show, 06, WT, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A23.65
Dim B4.775
Dim C13.20
Lead Style05.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows06
Weld Tab OptionWT
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec
NVAF-DP-06-1-07.0-S-2-K-TR 0.80 mm NovaRay® Extreme Density & Performance Socket -S: 30 µ” Selective Gold in Contact area, Matte Tin tail, -TR, 20.25, 6.775, 13.20, 07.0, -DP: 4 Pairs per Wafer, Show, 06, Not Available, -K: K-Pad - Provided as standard, 1, -2: 96.5% Tin/3.0% Silver/0.5% Copper
Plating-S: 30 µ” Selective Gold in Contact area, Matte Tin tail
Packaging Options-TR
Dim A20.25
Dim B6.775
Dim C13.20
Lead Style07.0
Style-DP: 4 Pairs per Wafer
Pad Show/Hide (Model Only)Show
Number of Rows06
Weld Tab OptionNot Available
Pad Option-K: K-Pad - Provided as standard
Banks1
Solder Ball Composition-2: 96.5% Tin/3.0% Silver/0.5% Copper
Samtec

Respondemos a todo lo que quieres saber (y nadie más responde)

1

¿Qué diferencia a TC Componentes como distribuidor de Samtec?

TC Componentes pone a tu disposición un profundo conocimiento técnico y gran experiencia en soluciones de interconexión.

Nuestra relación cercana con Samtec nos permite ofrecer soporte técnico avanzado y soluciones de diseño personalizadas, garantizando que cada proyecto se ejecute con la máxima precisión y eficiencia.

Esto te ahorra la abrumadora tarea de buscar el conector que necesitas y evita futuros errores que desestabilicen el proyecto.

Además, nuestra capacidad de respuesta es de las más rápidas del mercado. Nos comprometemos a que todas consultas y necesidades sean atendidas sin demoras ni tiempos muertos.

Por último, también gestionamos la entrega de productos listos para usar, reduciendo el tiempo de instalación y el riesgo de errores.

2

¿Qué tipo de proyectos atendéis en TC Componentes como distribuidores de Samtec?

Si eres un fabricante de equipos electrónicos en series cortas, medias o largas, y operas en sectores como electrónica industrial, automoción, electromedicina, telecomunicaciones, sistemas de seguridad, robótica o defensa, TC Componentes es tu socio ideal.

Nos enfocamos en dos tipos de clientes:

– Fabricantes que valoran un servicio eficiente y productos de alta calidad en sectores como máquinas de vending, sistemas de pago, videoporteros, elevadores, robótica, defensa, o electromedicina.

– Proyectos que se benefician de nuestra especialización, en los que nuestro conocimiento técnico garantiza soluciones precisas y eficientes.

3

¿Cuáles son las aplicaciones más frecuentes de los productos de Samtec?

Los productos de Samtec se utilizan frecuentemente en aplicaciones de automoción, aeroespacial, industrial, telecomunicaciones y centros de datos.

Además, debido a su conexión fiable y de alta velocidad en diversas aplicaciones críticas, también se utilizan en equipos médicos, de agricultura o transporte ferroviario y naval.

4

¿Por qué es importante elegir bien un conector para el diseño global?

Elegir el conector adecuado es crucial para el diseño global porque afecta directamente la fiabilidad y el rendimiento del sistema.

Un conector mal seleccionado puede causar fallos de conexión, interferencias y problemas de compatibilidad difíciles de detectar y solucionar, afectando a la integridad del diseño.

En TC Componentes, ayudamos a minimizar estos riesgos proporcionando asesoramiento técnico y soluciones de interconexión optimizadas, asegurando que cada componente se integre de manera eficiente en el sistema.

5

¿Hacéis muestras gratuitas de los productos de Samtec?

Sí, ofrecemos muestras gratuitas para que los clientes prueben y evalúen los conectores en sus propios entornos antes de realizar una compra a gran escala.

Las muestras ayudan a garantizar que el producto elegido cumple con los requisitos técnicos y operativos específicos del proyecto.

6

¿Cuáles son los plazos de entrega de los productos de Samtec?

Samtec se distingue por su rapidez en la entrega. Además, para casos urgentes ofrece un servicio llamado «sudden service» que garantiza envíos desde fábrica de más de 200.000 piezas en tan solo 24 horas desde la confirmación del pedido.

En TC Componentes, aprovechamos esta agilidad para asegurar que recibas tus productos de manera eficiente, adaptándonos a tus necesidades específicas y reduciendo al mínimo los tiempos de espera.

7

¿Cuáles son los siguientes pasos para obtener más información o realizar un pedido?

Para obtener más información o realizar un pedido, contacta con nuestro equipo de ventas y soporte técnico.

Estamos disponibles para responder a tus preguntas, proporcionar asesoramiento personalizado y ayudarte a seleccionar los productos más adecuados para tu proyecto.

Puedes contactarnos a través de nuestra web y te responderemos en un plazo máximo de 48 horas.

Contáctanos

Contáctanos directamente

puedes contactar por teléfono, correo o email

Tel. (34) 93 590 28 30

TC COMPONENTES S.L.

Camí de Can Calders, 6 local 12G
08173 SANT CUGAT DEL VALLÉS (Barcelona – España)

infoweb@tc-componentes.es

Potencia en soluciones de electrónica industrial  a tu alcance

O rellena el formulario

Danos tus datos y un resumen de lo que necesitas y nos pondremos en contacto contigo.

TC Componentes – Mayorista de electrónica industrial
Certificado ISO 9001 — TC Componentes

Trabajamos con los mejores fabricantes mundiales y te traemos los componentes electrónicos que necesitas para que tu proyecto sea un éxito.

Encuentra tu componenteEncuentra tu componente

TC COMPONENTES S.L.U.
Camí de Can Calders 6, local 12G
08173 SANT CUGAT DEL VALLÉS
Teléfono: (34) 93 590 2830
Email: infoweb@tc-componentes.es

(c) 2026 TC Componentes S.L. Todos los derechos reservados. Diseño web: The Art of Ecommerce

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infoweb@tc-componentes.es

(34) 93 590 28 30

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