TC Componentes es distribuidor de Samtec en España y Portugal
Elige entre millones de conectores sin retrasar tu diseño. Samtec está en el top 3 de los fabricantes de conectores de PCB a nivel mundial. Y es el fabricante con el mejor servicio al cliente (mejor servicio al cliente durante 18 años consecutivos, Bishop Associates).
Con Samtec y TC tienes muestras en 48h, entregas rápidas sin pedidos mínimos, y productos sin obsolescencias. Y la posibilidad de personalización extrema: hay más de 2.000 millones de productos posibles. No tienes por qué quedarte con una especificación de serie hecha para otro caso. Ahorra tiempo con nuestro asesoramiento y selecciona de manera eficaz los componentes adecuados para tu producto. Porque si falla el conector, falla todo.
Personalización extrema
con millones de combinaciones posibles
Asesoramiento técnico
para elegir el conector perfecto
Entrega rápida
sin pedidos mínimos
300.000 coches eléctricos funcionan gracias a nuestros conectores
Catálogo de componentes Samtec
High-Speed Board-to-Board
Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.
High-Density Arrays
Samtec high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.
NovaRay® 128 Gbps PAM4, Extreme Density Arrays
NovaRay® combines extreme density and performance for 128 Gbps PAM4 per channel in 40% less space than traditional arrays.
AcceleRate® HP High-Performance Arrays
AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design. View the full line of AcceleRate® products.
SEARAY™ High-Density Open-Pin-Field Arrays
These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.
SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays
These 0.80 mm pitch high-density arrays feature an open-pin-field for up to 50% board space savings.
LP Array™ Low Profile Open-Pin-Field High-Density Array
These low profile open-pin-field arrays feature stack heights down to 4 mm with up to 400 total I/Os.
SUPERNOVA™ Low Profile Compression Interposers
High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.
HD Mezz Array
Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.
High-Speed Dual Row Strips (Mezzanine)
Samtec offers the largest variety of high-speed board-to-board interconnects in the industry with full engineering support, online tools and an unmatched service attitude. High-speed mezzanine solutions include Q Series® ground plane connectors for reliable performance in space-saving designs, as well as Edge Rate® connector strips optimized for signal integrity performance to 56Gbps PAM4 in a wide variety of stack heights. Extended Life Product™ (E.L.P.™) certified solutions are tested to rigorous standards, which evaluate contact resistance in simulated storage and field conditions: 10 Year Mixed Flowing Gas (MFG) and high mating cycles (250 to 2,500).
Q Pairs® Differential Pair Mezzanine Connectors
Samtec Q Pairs® differential pair mezzanine connectors are designed for high-speed board-to-board applications where signal integrity is essential.
High-Speed Edge Cards
Samtec offers a full line of edge card connectivity solutions for industries and applications including datacom, industrial, high-performance computing, and the PCI Express® market, along with a product roadmap to support 64 Gbps speeds and beyond. Solutions include a wide variety of options – a choice of pitch, pin count, orientation and designs such as power/signal combo or press-fit tails, plus ruggedizing features.
SATA Socket, Serial ATA High-Speed Link Card Sockets
High-speed, low profile micro plane SATA socket accommodates variable mating card thickness and features a large deflection BeCu contact system.
SFP Connectors & SFP+ Data Transmission Systems
SFP connectors, transceiver interface sockets and single or ganged cages. Mates with SFP, SFP+, XFP, or ZENPAK transceivers.
Micro TCA High-Speed Edge Card Connectors
These micro TCA high-speed edge card connectors support hot plugging and high-speed serial connections with up to 170 total I/Os.
Mini Edge Card Guide Sockets
Mini edge card guide sockets with up to 50 total I/Os that accommodate 0.80 mm and 1.60 mm thick cards.
Ultra Micro Interconnects
Samtec's ultra micro interconnects feature fine pitches, slim body designs and extremely low profiles for incredible design flexibility with high-speed performance up to 56 Gbps PAM4. Self-mating Razor Beam™ interconnects reduce inventory costs, and can be interchanged for a variety of stack heights from 5 to 12 mm with optional EMI shielding. Razor Beam™ contacts feature undercut retention notches with an audible click when mated; this increases mating/unmating forces by 4 to 6 times compared to typical micro pitch connectors. Micro Blade & Beam systems feature incredibly fine pitches and ultra low stack heights down to 2 mm. Jack screw standoffs are available for unmating assistance and protection from component damage.
Micro Blade & Beam 0.40 mm & 0.50 mm Fine Pitch Connectors
These Micro Blade & Beam 0.40 mm & 0.50 mm fine pitch connectors feature an ultra slim, ultra low profile for increased board space savings.
Backplane Connectors
High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility. NovaRay® micro rugged backplane system enables performance to 112 Gbps PAM4 with an offset footprint and provides configurable signal banks for design flexibility.
XCede® HD High-Density Backplane System
Samtec's XCede® HD high-density backplane system features a small form factor ideal for density-critical applications, and a modular design for flexibility and customizable solutions.
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